Efficient Power Conversion (EPC) has added EPC7014, a 60 V, 340 mΩ, 4 APulsed, rad-hard eGaN FET to a new family of radiation-hardened gallium nitride transistors and integrated circuits.
The Thermopad Temperature Variable Attenuator, SpaceNXT K2TVA has been introduced by Smiths Interconnect for attaining gain compensation over the temperature in critical space flight applications.
Gowanda Electronics’ four new internal solder-free Ceramic Wirewound Chip Inductor (CC0402, CC0603, CC0805, and CC1008) series have been released for increasing the reliability in Space/Aero programs.
Toshiba Electronics Devices and Storage Corporation has introduced the TLP4590A, a 1-Form-B (normally closed) photo relay with a 60V OFF-state output terminal voltage rating. The new device offers high ON-state current rating of 1.2A in a DIP6 package.
Infineon Technologies has introduced the DLA Qualified Manufacturers List Class V (QML-V) certified next-generation 144-Mb Quad Data Rate II+ (QDR -II+) SRAM.
Microchip Technology has introduced the Arm Cortex-M7 SoC radiation-hardened technology implemented SAMRH71 Arm-based microprocessor (MPU) and the SAMRH707 microcontroller (MCU).
The new PolarFire Field Programmable Gate Arrays (FPGAs) qualified for both the Automotive Electronics Council Q100 (AEC-Q100) specification Grade T2 (-40°C to 125°C TJ) and military temperature grade