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SDP3X – Compact Differential Pressure Sensors
SDP3X – Compact Differential Pressure Sensors

SDP3X – Compact Differential Pressure Sensors

With a dimension of only 5mm × 8mm × 5mm, Sensirion has launched a new series of Pressure sensors, which it claims to be the world’s smallest differential Pressure sensors. These…
REC15E-Z 15W DC/DC Converter for cost sensitive and compact applications
REC15E-Z 15W DC/DC Converter for cost sensitive and compact applications

REC15E-Z 15W DC/DC Converter for cost sensitive and compact applications

RECOM  Power has today launched a new isolated DC/DC converter with case size of only 1” × 1”. This 15W converter can provide isolation upto 1600VDC with an efficiency of 90% and…
IHLP Inductors – Low Profile and High Current Inductors
IHLP Inductors – Low Profile and High Current Inductors

IHLP Inductors – Low Profile and High Current Inductors

Earlier in the month of September, Vishay Intertechnology extended a new family of inductors called the IHLP Inductors.  These Inductors have a low DCR value and high current…
MAX86150 – Integrated Electrocardiogram (ECG) and Photoplethysmogram (PPG) Bio-Sensor for mobile health monitoring
MAX86150 – Integrated Electrocardiogram (ECG) and Photoplethysmogram (PPG) Bio-Sensor for mobile health monitoring

MAX86150 – Integrated Electrocardiogram (ECG) and Photoplethysmogram (PPG) Bio-Sensor for mobile health monitoring

Maximum Integrated has launched a new bio-sensor which can measure both PPG and ECG as a single package. This sensor is aimed to be used in portable mobile devices like Smart…
IEWS20R5135IPB – Protected IGBT with built-in driver IC for Induction Heating Applications
IEWS20R5135IPB – Protected IGBT with built-in driver IC for Induction Heating Applications

IEWS20R5135IPB – Protected IGBT with built-in driver IC for Induction Heating Applications

Infineon Technologies has launched the new F-Series Protected IGBTs with TRENCHSTOP feature. This new IGBT includes built-in logic functionality and a dedicated driver IC which is…
Lakefield Chip – A 10 Nano Meter Processor from Intel
Lakefield Chip – A 10 Nano Meter Processor from Intel

Lakefield Chip – A 10 Nano Meter Processor from Intel

  During the 2019 CES conference Intel has demonstrated its new ultra compact 10nm Processor called the Lakefield. These processors consists of a hybrid CPU that packs in a 10nm…
BM14270MUV-LB Ultra-compact contactless current sensor for industrial equipment and consumer devices
BM14270MUV-LB Ultra-compact contactless current sensor for industrial equipment and consumer devices

BM14270MUV-LB Ultra-compact contactless current sensor for industrial equipment and consumer devices

With a form factor of only 3.5mm square ROHM semiconductors has launched a new contact less current sensor for high power applications like servers in data centers and solar power…
PI4ULS5V108 – 8-bit Bidirectional Level shifter for inter-IC communication operating on different voltages
PI4ULS5V108 – 8-bit Bidirectional Level shifter for inter-IC communication operating on different voltages

PI4ULS5V108 – 8-bit Bidirectional Level shifter for inter-IC communication operating on different voltages

Diodes Incorporated has today launched a new 8 channel high speed bidirectional level shifter for Open-Drain and Push-pull applications. This new IC called PL4UL5V108 is designed…
TC78H653FTG – Low Voltage, high current dual H-Bridge Driver IC for Brushed DC Motors and Stepper Motors
TC78H653FTG – Low Voltage, high current dual H-Bridge Driver IC for Brushed DC Motors and Stepper Motors

TC78H653FTG – Low Voltage, high current dual H-Bridge Driver IC for Brushed DC Motors and Stepper Motors

Focused to be used in battery operated low voltage equipments like mobile devices, USB drivers and other portable home electronic products Toshiba Electronic Devices has launched…
SLM97 – Miniaturized industrial-grade eSIM for M2M applications
SLM97 – Miniaturized industrial-grade eSIM for M2M applications

SLM97 – Miniaturized industrial-grade eSIM for M2M applications

With a dimension of only 2.5mm×2.7mm, Infineon Technologies has launched an industrial-grade embedded SIM (eSIM) in a Wafer-level- Chip-scale Package (WLCSP) which it claims to be…